Soldering a BGA (BGA Soldering)
Soldering a ball grid array.
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.
A method for decreasing B G A rework cycle time.
1- Prepare site: clean off excess solder. Clean site with alcohol. Dry.
2- Align and place Stencil Quik over land patterns on PCB.
3- Squeegee paste onto stencilquik
4- engage BGA StencilQuik patterns then reflow.
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