Microvia (High Density Interconnect, HDI) PCB manufacturing technology has developed rapidly in recent years, and can now be used to reduce bare-board cost where a Through Hole Plate (THP) board would need 10 or more layers.
And microvia’s benefits for good EMC (and SI and PI) design at board level mean it can reduce overall unit-cost-of-manufacture even where THP boards would require fewer than 10 layers.
This webinar looks at what microvia board techniques are now available, and how they can be used to help achieve good EMC whilst reducing costs and getting to market more quickly.
